Compact Bonding Laser / CB Series

• The product allows the selection of an optimum wavelength for the workpiece to be processed, such as highly reflective materials (copper, gold), to achieve high-efficiency and high-quality soldering operations.
• The product can be used for a wide range of applications, including soldering and resin welding, by setting irradiation conditions accordingly.
• The combination of transmission optical fiber and optical components allow the selection of an optimum laser spot diameter and shape for processing conditions.
• A radiation thermometer can be connected to prevent the overheating and burning of workpieces.
• The compact body design allows installation in any location, and the equipment on which the product will be mounted can be miniaturized or reduced to a desktop size.

Features of a short wavelength laser (blue)

The absorption rate is several-fold higher with highly reflective materials, such as copper and gold, compared to an infrared laser.

The land to be soldered can be heated on low power.

• Flexible waveform control

Sixteen irradiation patterns can be selected via a user option on the operation panel (optional).

• Laser output waveform setting

• Shot mode setting

• Laser spot shapes

A variety of laser spot shapes are selectable according to the workpiece

• Burning prevention function (temperature limiter)

By connecting a radiation thermometer, this function will turn the product on and off at the preset temperature to prevent

the burning of substrates.

The coaxial optical lens tube with a radiation thermometer (optional) accurately

detects the temperature of the processing point.

• Laser soldering case examples

With a local heating feature, the CB series is perfect for the automated processing of less heat-resistant components and components in need of manual soldering in minute sections.